| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor which reduces detection errors due to thermal strain, particularly a semiconductor acceleration sensor utilizing piezoresistance, and a semiconductor acceleration sensor package utilizing the semiconductor acceleration sensor. SOLUTION: A thick-walled weight part 21 is fabricated which extends from a semiconductor substrate to the center of a support part 23 in the form of a rectangular frame, in such a manner that a detecting part 20 suspended and supported in a cantilevered manner by two beam-shaped deflecting parts 22 is integrated with the weight part. A lower cap 30 made of heat resisting glass with a recess 31 formed on its inner surface and an upper cap 40 formed with a recess 41 therein are joined respectively to the upper and lower faces of the detecting part 2 at, for example, both ends thereof, to obtain an acceleration sensor chip 1. In this case, the lower cap 30 is formed in a shape of an inverted regular pyramidal frustum, by shaving off the four sides of a plate-shaped glass substrate. Using the lower end face of the lower cap 30 as a joining face 32, the acceleration sensor chip 1 is joined to a substrate 50 fabricated from a 42-alloy or the like, and the semiconductor acceleration sensor 1 is obtained. |
