BUMP SHEET, DOUBLE-SIDED BUMP CONNECTING INSULATION SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE BUMP SHEET

摘要

PROBLEM TO BE SOLVED: To provide a bump sheet improving reliability by suppressing the breakage of a connection part caused by heat expansion due to temperature change. SOLUTION: The bump sheet 3 for electrically connecting a board such as a semiconductor chip 2 and a TAB tape 4 has an insulation sheet 3a providing a through hole 3c corresponding to the connection part of the semiconductor chip 2 and the TAB tape 4 and a conductive metal electrode 3b formed on the one side of the insulation sheet 3a so as to block the through hole 3c. Metal bumps 6 are joined on the surface and rear face of the conductive metal electrode 3b respectively. Thereby a prescribed distance can be secured between the semiconductor chip 2 and the TAB tape 4, and the relative movement of both can be absorbed.