| 摘要 |
PROBLEM TO BE SOLVED: To realize inexpensive and high performance Bi-CMOS process. SOLUTION: A side wall 119A is left on the side wall of an opening part by ansotropically etching (RIE) a TEOS silicon oxidation film 117, a spacer 119B is formed on a level difference part between the gate part of a MOS transistor and a Poly-Si film, and further the Poly-Si film 120 is accumulated on the whole face. Thereafter a silicon oxidation film 125 is accumulated, patterning for forming a low resistance diffusion layer for emitter and MOS source/drain taking-out is performed, As+ ion is injected on the emitter part of a bi-polar transistor and the source/drain taking-out part of an NMOS transistor, and BF2+ ion is injected to the source/drain taking-out part of a PMOS transistor. Heat treatment is performed to form the emitter and source/drain taking-out area by self alignment.
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