发明名称 HEAT CONVEYING DEVICE
摘要 PROBLEM TO BE SOLVED: To permit the miniaturization of a device (1) and reduce the restriction of the arrangement of units by reducing the required head difference between a heating heat exchanger (41) or a cooling heat exchanger (42) and tanks (T1, T2) in a heat conveying device. SOLUTION: A mechanical pump (60) is used together with a so-called thermal drive pump (40) for the conveyance of refrigerant from a cooling heat exchanger (42) to tanks (T1, T2) or the conveyance of the refrigerant from the tanks (T1, T2) to a heating heat exchanger (41).
申请公布号 JP2001336842(A) 申请公布日期 2001.12.07
申请号 JP20000161682 申请日期 2000.05.31
申请人 DAIKIN IND LTD 发明人 HORI YASUSHI
分类号 F24F5/00;F25B1/00;F28D15/02;(IPC1-7):F25B1/00 主分类号 F24F5/00
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