| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit unit suitable for miniaturization and superior in mass production. SOLUTION: A circuit element including capacitors C1-C7, resistors R1-R3, inductance elements L1-L3 and the like is formed on a large-sized board 1A comprising an alumina material in a thin film, after a diode D1 and the semiconductor bare chip of a transistor Tr1 are bonded by a wire, the large-sized board 1A is divided into strip-like boards 1B, and an end face electrode 3 is provided on both the sides. A cover continuous body 2A continuously forming a plurality of covers 2 is prepared through a connection part 2c, a plurality of the cover continuous bodies 2A are juxtaposed in parallel, and a plurality of the strip-like boards 1B are incorporated from the direction orthogonal to the extending direction of the connection part 2c for each cover 2 in the state that each cover 2 is arranged in the form of a matrix. Next, after a leg piece 2a formed on each cover 2 is soldered on the end face electrode 3 of the strip-like board 1B, the finished product of the electronic circuit unit attaching the cover 2 to an individual alumina board 1 by cutting the strip-like board 1B and the connection part 2c of the cover continuous body 2A. |
