| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a circuit which requires no large- scale manufacturing equipment such as a vacuum chamber and therefore allows a low-cost manufacturing of a circuit, and which is suitable for formation of a circuit pattern especially on a three-dimensional structure. SOLUTION: In this method for forming a circuit, a creeping discharge board 1 is used which consists of a flat electrode 2 and streak electrodes 4 that are laminated through a dielectric layer 3. The flat electrode 2 is so molded as to comply with the shape of the surface of a circuit formation face of an insulation molding 10, and the streak electrodes 4 are formed with openings 4a in compliance with a circuit pattern. With the streak electrodes being abutted against the circuit formation face of the insulation molding 10, voltage is applied between the streak electrodes 4 and the flat electrode 2 to apply a plasma treatment to parts of the circuit formation face of the insulating molding 10 which face the openings 4a of the streak electrodes 4. Thereafter, a conductive material is attached to the plasma treated regions by an electroless plating method.
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