| 摘要 |
PURPOSE: To inhibit bismuth precipitation causing age-hardening and dross formation of elements added, phosphorus is added to the conventional lead-free solder composition. The phosphorus, in melted condition, rises to the surface of liquid solder composition to form a thin layer, whereby blocking contact between liquid solder composition and air. CONSTITUTION: The solder composition is characterized by comprising 0.1-7.0wt.% copper, 0.5-5.0wt.% silver, 0.0001-3.0wt.% phosphorus, and a balance of tin. Because the obtained solder composition has narrow solidifying range, it is useful to automated soldering and increased spreading property.
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