| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a three-dimensional image processor which can sharply simplify the manufacture process due to needlessness of mounting and removal process of a supporting board, can manufacture a three-dimensional image processor by simple and easy process, and can form embedded wiring surrounded by a highly reliable insulating film. SOLUTION: A transparent substrate 10 made of quartz glass, where many microlenses 12 are made two-dimensionally, is bonded to a photoelectric transfer substrate 20 where a photodiode and a MOS transistor are made on an n-type silicon crystalline substrate 16 wherein an insulating layer 36 consisting of silicon diode is inserted, through an adhesive 14 consisting of high polymer material such as epoxy resin, polyimide resin, or the like, so that the main face of the photoelectric transfer substrate 20 and the rear of the transparent substrate 10 may oppose to each other. |
