| 摘要 |
PURPOSE: An etching apparatus, and a washing apparatus and their methods are provided, to remove the unnecessary material existed on a semiconductor wafer effectively without damaging the apparatus area. CONSTITUTION: The etching (or washing) apparatus comprises a rotation means which holds an apparatus area and a semiconductor wafer(10) provided with a surface surrounding area placed in the exterior of the apparatus area on the surface; an edge nozzle(18) which sprays an etching (or washing) liquid toward the surface surrounding area of the wafer, to etch (or remove) the unnecessary material existed in the surface surrounding area selectively; optionally a back face nozzle(16) which sprays an etching (or washing) liquid toward the center of back face(P2) of the wafer, to etch (or remove) the unnecessary material existed in the back face of the wafer; and optionally a front face nozzle(14) which sprays a protection liquid toward the center of front face(P1) of the wafer, to coat the apparatus area of the wafer and to protect the apparatus area from the etching liquid sprayed from the etching nozzle(18).
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