DIE BONDING APPARATUS AND SUCTION NOZZLE FOR DIE BONDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a die bonding apparatus where an electronic component can be implemented on a metal stem automatically, and to provide its suction nozzle. SOLUTION: The suction nozzles 5A, 5B are configured so as to comprise a nozzle body part 60 for sucking a stem base 24 of the stem 2 at their tips and positioning pins 63 that are arranged outside a suction opening 61 provided in the nozzle body part 60 and are protruded from the tips of the nozzle body part 60 so as to insert into a positioning part 25 provided in the stem base 24.