| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system effectively suppressing the generation of particles and keeping uniformity in film deposited on a substrate without any problem in the production, and in which, after exchanging the stick- preventive shields, film deposition is pre-formed where thin films are deposited on the stick-preventive shields. SOLUTION: After exchanging the stick-preventive shields 481, 482 and 483 and a target 41, the inside of a sputtering chamber 4 is exhausted by an exhaust system 46, thereafter, a dummy substrate 91 which has been retreated to a retreating chamber 40 in the sputtering chamber 4 is moved to the substrate holding face of a substrate holder 44 by a moving mechanism 40 for dummies, and the substrate holding face is covered. Then, a sputter power source 43 is activated to generate sputter discharge and to sputter the target 41. Then film deposition is preformed where thin films are thinly deposited on the surfaces of the sticking preventive shields 481, 482 and 483.
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