发明名称 THIN FILM FORMING DEVICE AND METHOD FOR POLYMER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an efficiently thin film forming device used for polymer substrates, solving the problem that the control of oxygen partial pressure for the thin film formation is difficult, and a method for the same. SOLUTION: This device has at least substrate carriers which can be mounted with the plural high polymer substrates, a heating and vacuum deaerating chamber 11 which can subject a plurality of the substrate carriers all together to heating and vacuum deaerating, a pretreatment chamber 15 which perform the heating and vacuum deaerating of the substrate carriers subjected to the heating and vacuum deaerating in the heating and vacuum deaerating chamber by one piece each, a buffer chamber where the substrate carriers subjected to the heating and vacuum deaerating in the pretreatment chamber are temporarily held, a deposition camber 110 which subjects the substrates treated in the buffer chamber to thin film forming treatment, a buffer chamber where the substrate carriers subjected to the thin film forming treatment are temporarily held and a substrate carrier taking-out chamber 116 where the substrate carriers subjected to the treatment in the respective chambers are taken out. The respective chambers described above are so constituted the respective treatments from the heating and vacuum deaerating treatment in the heating and vacuum deaerating chamber to the substrate carriers taking-out chamber may be successively and continuously carried out.
申请公布号 JP2001335916(A) 申请公布日期 2001.12.07
申请号 JP20000154781 申请日期 2000.05.25
申请人 RICOH CO LTD 发明人 TANAKA MASAHARU;SUGAWARA TOMOAKI;SATO TATSUYA
分类号 G02F1/1333;C23C14/02;G02F1/1343;G11B7/26;G11B11/105;(IPC1-7):C23C14/02;G02F1/133;G02F1/134 主分类号 G02F1/1333
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