| 摘要 |
A display has a cathode 1 and an anode 2. These are in plate form and held spaced apart by a peripheral frame 3, to which they are both sealed. The cathode has an emission layer 11 deposited on a front ceramic layer 12 with vias 14 to the emission layer. The foundation layer is fired, ground flat and has via apertures cut through it and filled 17 prior to lamination of the front layer. Onto the back face of the substrate, preferably prior to deposition of the emission layer, is spun on a dielectric layer 21, which is developed with the aid of a temporary mask (not shown) to provide etchable tracks. These are etched to leave grooves 22 corresponding to metallic interconnections 23 from the foundation layer vias 17 to vias 24 in the next dielectric layer 25, typically thicker than the previous one 21. The metallic interconnections 23 are formed by screen printing and firing. Then another pair of dielectric layers 26, 27 is laid down, developed, etched and filled with interconnections 28 and vias 29 for connection to next vias. The process is continued to build four pairs of dielectric layers behind the foundation layer 16. In each successive layer, the vias are progressively spaced further apart and their arrangement organised so that they can make contact, via metallic pads 31 provided in like manner to the interconnection tracks, with driver chip contacts.
|
