| 摘要 |
Method and apparatus for processing semiconductor wafers in a vacuum chamber in which a plurality of wafers are stored in a cassette outside the chamber, wafers are transferred between the cassette and a staging station inside the chamber with a transfer mechanism located outside the chamber, and wafers are transferred between the staging station and a processing station within the chamber with a transfer mechanism located inside the chamber. In some embodiments, the staging station moves back and forth between the processing chamber and a load lock, with a closure connected to the staging station sealing off the processing chamber when the staging station is in the load lock and wafers are being transferred between the staging station and the cassette.
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