| 发明名称 |
Semiconductor chip removing and conveying method and device |
| 摘要 |
Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.
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| 申请公布号 |
US2001049160(A1) |
申请公布日期 |
2001.12.06 |
| 申请号 |
US20000746066 |
申请日期 |
2000.12.26 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
WATANABE MITSUHISA;TESHIROGI KAZUO;YOSHIDA EIJI;SHIMOBEPPU YUZO;KONNO YOSHITO;TAMAKI KYOUHEI |
| 分类号 |
H01L21/67;H01L21/00;H01L21/301;H01L21/68;H01L21/78;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/67 |
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