发明名称 Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte
摘要 Disclosed is a method and apparatus for mounting an electrical connector on a printed wiring board. The printed wiring board is initially positioned on loca ting projections on a tooling plate. Eyelets are positioned in hold down apertures in the connector. The hold down apertures initially engage the locating projections to align the connector pins with pin receiving apertures on the printed wiring boar d. Engagement continues until the pins are positioned in the apertures and the lowe r end of the eyelet is deformed to engage the innerside of the down aperture and t he lower side of the printed wiring board. <IMAGE>
申请公布号 DE69616419(D1) 申请公布日期 2001.12.06
申请号 DE1996616419 申请日期 1996.05.15
申请人 BERG ELECTRONICS MANUFACTURING B.V., S'-HERTOGENBOSCH 发明人 CLARK, STEPHEN L.;HORCHLER, DAVID C.;STONER, STUART C.;PONTIUS, GLENN J.;NAILOR III, WILLIAM K.
分类号 H01R12/55;H01R43/20;H05K3/30;(IPC1-7):H01R12/20 主分类号 H01R12/55
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