发明名称 |
Mounting substrate and heat sink for high-power diode laser bars |
摘要 |
Mounting substrate and heat sink for high-power diode laser bars, the mounting substrate permitting mounting of the high-power diode laser bars by hard-soldering on the basis of a matching expansion to the semiconductor material. The mounting substrate is difficult to bend and of extremely high thermal conductivity, and can be used universally for the various cooling elements of conductive and convective cooling mechanisms.
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申请公布号 |
US2001048698(A1) |
申请公布日期 |
2001.12.06 |
申请号 |
US20010798434 |
申请日期 |
2001.03.02 |
申请人 |
LORENZEN DIRK;DORSCH FRIEDHELM |
发明人 |
LORENZEN DIRK;DORSCH FRIEDHELM |
分类号 |
H01L23/373;H01S5/024;H01S5/40;(IPC1-7):H01S3/04 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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