发明名称 Exposure apparatus, device manufacturing method, semiconductor manufacturing plant and method of maintaining exposure apparatus
摘要 An exposure apparatus includes a plurality of purge spaces delimited along the optical path between the laser light source and the substrate by housings the boundary members of which are invisible to the exposing light, and pressure regulating unit for exercising control in such a manner that the pressure within each purge space attains a predetermined value. In the exposure apparatus that is purged in sections, therefore, it is possible to reduce the amount of deformation of the end faces between mutually adjacent purge spaces, e.g., the end face of a projection optics unit.
申请公布号 US2001048084(A1) 申请公布日期 2001.12.06
申请号 US20010865454 申请日期 2001.05.29
申请人 UZAWA SHIGEYUKI 发明人 UZAWA SHIGEYUKI
分类号 G03F7/20;G21K5/04;H01L21/02;H01L21/027;(IPC1-7):G21K5/10;H01J37/08 主分类号 G03F7/20
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