Halbleiterbauelement mit Oberflächenmetallisierung

摘要

The invention relates to a semiconductor component comprising a surface metallization. Said component has at least one semiconductor body (3) and a housing base body (2), on whose surface conductor strip structures (7) are formed by means of surface metallization. A partial zone of the conductor strip structures (7) constitutes the solder connections (1) of the semiconductor element. Said solder connections (1) are combined to form rows, whereby the individual solder connection rows are separated from one another by short, predetermined intervals.