Electronic component cooling device has housing through which cooling medium is circulated provided by hollow profile sealed on its open side by cooling plate in thermal contact with component

摘要

The cooling device (1) has a housing provided with an inlet and an outlet for a cooling medium and having a metallic cooling surface in thermal contact with the electronic component (7). The housing is provided by a metal or plastics hollow profile (3) which is open on one side, closed by a flat cooling plate (2) in thermal contact with the electronic component. An Independent claim for a cooling system for an electronic processor is also included.