| 摘要 |
A method for filling vias (132) in an electronic substrate (130) which includes providing a source of fill material (141, 142); providing a pressure head (200) coupled to the source of fill material (141, 142) via a fill material inlet (120), the pressure head further comprising an elongated fill material outlet (340) which is substantially larger than the fill material inlet (120); placing the pressure head (200) in contact with the electronic substrate (130); and pressurizing the fill material to inject fill material into the vias (132) of the electronic substrate (130). |
