| 摘要 |
A carrier and polishing apparatus enabling high precision polishing of a workpiece and enabling prevention of leak contamination and damage to the workpiece. A carrier (1) is provided with a carrier body (2), a pressure chamber (3), and a fluid passage portion (4) and a plurality of valve portions (5) are specially provided in the pressure chamber (3). Due to this, when the inside of the pressure chamber (3) becomes a negative pressure state, the valve portions (5) open and the wafer W is picked up by suction, while when it becomes a positive pressure state, the valve portions (5) close and the air in the pressure chamber (3) uniformly presses against the wafer W. Further, since the valve portions (5) close in the positive pressure state, the air in the pressure chamber (3) will not flow to the outside. <IMAGE> |
