Semiconductor device using substrate having cubic structure and method of manufacturing the same

摘要

A plurality of semiconductor chips bent along the outer circumferential surface of a cylindrical substrate are mounted to the outer circumferential surface of the substrate. The bumps of these semiconductor chips are connected to connection pads formed on the outer circumferential surface of the substrate. By diminishing the curvature radius of the bent semiconductor chips, the size of the semiconductor module can be made smaller than the size of the chip.