Slurry used for the chemical-mechanical polishing of semiconductor components comprises water, grinding grains and a polymer additive having hydrophilic as well as hydrophobic groups

摘要

Slurry comprises water, grinding grains and a polymer additive having hydrophilic as well as hydrophobic groups. An Independent claim is also included for a process for the production of a semiconductor component using the slurry. Preferred Features: The slurry has a pH of 7-11.