| 发明名称 |
MULTI-CHIP LAND GRID ARRAY CARRIER |
| 摘要 |
A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto. |
| 申请公布号 |
US2001047882(A1) |
申请公布日期 |
2001.12.06 |
| 申请号 |
US19990398652 |
申请日期 |
1999.09.17 |
| 申请人 |
SAMARAS WILLIAM A.;PHILLIPS PAUL T.;BROWNELL MICHAEL P. |
发明人 |
SAMARAS WILLIAM A.;PHILLIPS PAUL T.;BROWNELL MICHAEL P. |
| 分类号 |
H01L23/498;H01L25/16;H05K1/02;H05K1/14;H05K3/34;H05K3/36;(IPC1-7):H05K1/11;H01R9/00;H01R12/04 |
主分类号 |
H01L23/498 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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