| 摘要 |
<p>The invention concerns a semiconductor device with vertical electronic injection comprising a support substrate (2), a structure including at least a thin monocrystalline film (7) transferred onto the support substrate and integral with the support substrate, at least an electronic component, the support substrate (2) comprising at least a recess for electrical or electronic access to the electronic component through the thin monocrystalline film, the device further comprising means (13, 14) for vertical electronic injection into the electronic component.</p> |
