Wafer-level fabrication of stacked electronic chips,申请号SE20010004132-传众专利搜索

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发明名称	Wafer-level fabrication of stacked electronic chips
摘要
申请公布号	SE0104132(D0)	申请公布日期	2001.12.05
申请号	SE20010004132	申请日期	2001.12.05
申请人	FRANK NIKLAUS;GOERAN STEMME;JOACHIM OBERHAMMER	发明人	FRANK NIKLAUS;GOERAN STEMME;JOACHIM *OBERHAMMER
分类号	H01L;(IPC1-7):H01L	主分类号	H01L
代理机构		代理人
主权项
地址

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