发明名称 |
ELECTROLESS PLATING SOLUTION AND METHOD OF FORMING WIRING WITH THE SAME |
摘要 |
<p>The present invention provides an electroless plating liquid which allows a plating rate to be controlled, is not largely influential on semiconductor characteristics, and poses no problem on the health of workers, and a method of forming an interconnection according to a electroless plating process which uses such an electroless plating liquid. The electroless copper plating liquid contains dihydric copper ions, a complexing agent, an aldehyde acid, and an organic alkali. The electroless copper plating liquid is preferably be used in a method having the steps of forming an auxiliary seed layer for reinforcing a copper seed layer in an interconnection groove defined in a surface of a semiconductor device, and performing an electrolytic plating process using the seed layer including the auxiliary seed layer as a current feeding layer, for thereby filling copper in the interconnection groove defined in the surface of the semiconductor device. <IMAGE></p> |
申请公布号 |
EP1160356(A1) |
申请公布日期 |
2001.12.05 |
申请号 |
EP20000985822 |
申请日期 |
2000.12.21 |
申请人 |
EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
INOUE, HIROAKI;MISHIMA, KOJI;NAKAMURA, KENJI;OKUYAMA, SHUICHI;MATSUDA, TETSUO;KANEKO, HISASHI |
分类号 |
C23C18/16;C23C18/40;H01L21/288;(IPC1-7):C23C18/40;H01L21/320 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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