发明名称 |
THERMAL BONDING METHOD AND APPARATUS |
摘要 |
A thermal bonding method wherein at least two members are thermally bonded to each other with an adhesive by pressing and heating a laminate formed by laminating at least two members on each other with the adhesive interposed therebetween, comprising placing at least one member of the laminate close to a heated radiation heater and pressing the laminate in a radiation heat-applied state; and an apparatus comprising a radiation heater, a supporting member for supporting the laminate with at least one member of the laminate placed close to the radiation heater, and a pressing unit adapted to approach, contact and press the laminate supported by the supporting member and then move away from the laminate to stop applying a pressure to the same. <IMAGE> |
申请公布号 |
EP1018425(A4) |
申请公布日期 |
2001.12.05 |
申请号 |
EP19980941742 |
申请日期 |
1998.09.07 |
申请人 |
JAPAN BRAKE INDUSTRIAL CO., LTD. |
发明人 |
KOMINE, HARUO;NISHIMURA, AKIRA |
分类号 |
B32B37/10;B29C35/02;B29C35/08;B29C43/00;B29C43/18;B29C65/00;B29C65/14;B29C65/18;B29C65/48;B29L9/00;B29L31/16;C09J5/06;F16D69/04 |
主分类号 |
B32B37/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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