发明名称 |
High-density multi-layered printed wiring board having highly reliably through hole and method of producing said printed wiring board |
摘要 |
A high-density multi-layered printed wiring board in which a copper-clad multi-layered board has a hole having a diameter of 25 to 200 mu m and has at least three copper foil layers, wherein at least one hole is made with a laser and all connections between copper foil layers are done with a through-hole perforating through each of the copper foil layers, and a method of producing said multi-layered printed wiring board. <IMAGE> |
申请公布号 |
EP1061785(A3) |
申请公布日期 |
2001.12.05 |
申请号 |
EP20000305072 |
申请日期 |
2000.06.15 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
GAKU, MORIO;IKEGUCHI, NOBUYUKI;KATO, YOSHIHIRO;AOTO, HIROKI |
分类号 |
H05K3/00;H05K3/42;(IPC1-7):H05K3/00;B23K26/18;B32B15/08 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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