发明名称 Inkjet printhead design to reduce corrosion of substrate bond pads
摘要 Disclosed is an inkjet printhead including a substrate having a plurality of individual ink ejection elements formed on a first surface of said substrate, said ink ejection elements electrically connected to bond pads on said substrate, a barrier layer formed on said first surface of said substrate, said barrier layer defining a plurality of individual ink ejection chambers, said barrier layer further providing isolation of the bond pads on the substrate and a flexible circuit having electrical traces formed thereon, said electrical traces having leads attached to said bond pads; said flexible circuit overlaying and affixed to said barrier layer such that a plurality of nozzles formed in a nozzle member portion of said flexible circuit, such that said nozzles align with said ink ejection chambers and said ink ejection elements.
申请公布号 US6325491(B1) 申请公布日期 2001.12.04
申请号 US19990431064 申请日期 1999.10.30
申请人 HEWLETT-PACKARD COMPANY 发明人 FEINN JAMES A.
分类号 B41J2/14;(IPC1-7):B41I2/14 主分类号 B41J2/14
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