MULTI-STEP CHAMFERING METHOD FOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a multi-step chamfering method for a wafer reducing the chamfering allowance of the wafer, while holding the dimensional accuracy in the wafer circumference in the multi-step chamfering of the wafer. SOLUTION: After roughly grinding the wafer circumference, this multi-step chamfering method for the wafer further grinds precisely. The groove shape of a rough grinding wheel is optimized taking account of the chamfering allowance of the wafer circumferential part set in precise grinding so that the chamfering allowances of the tip part and the tapered part of the wafer circumferential part in the precise grinding are uniformized.