EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC PARTS DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent laser marking property and electric characteristics together with good moldability which can be fabricated into an electronic parts device with narrow gaps between pads or wires without occurrence of rejected article from short circuit due to electroconductive materials also with high reliability and excellent appearance of the surface of the package. SOLUTION: This epoxy resin composition comprises as the indispensable components (A) an epoxy resin, (B) a curing agent, (C) non-electroconductive carbon, and (D) an inorganic filler. This electronic parts device is equipped with elements sealed by the epoxy resin composition.