WORK POLISHING METHOD, WORK HOLDING PLATE AND WORK POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing technique for a work controlling polishing allowance of the work circumferential part into a prescribed shape and flattening the whole work surface without being affected by the shape of the work before polishing in polishing the circular work requiring an extremely precise flatness for a semiconductor wafer and the like. SOLUTION: This work holding plate holds the work via a plurality of through holes by vacuum absorption and has a mechanism controlling the pushing force towards the outer circumference of the work holding region in polishing the circular work surface by bringing it in contact with the polishing cloth by a prescribed pushing force. An annular elastic tube 11 having a fluid inlet port 14 is disposed in an annular groove 10 formed along the outer circumference of the work holding region 9 and the tube internal pressure is adjusted so that the pushing force in the circumferential part of the work W abutting on the bottom face of the tube 12 can be controlled.