| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which has excellent moldability, soldering stress resistance, high-temperature storing characteristics and flame retardance without containing a bromine compound and an antimony compound. SOLUTION: The composition is characterized, as the essential components, by containing (A) an epoxy resin, (B) a modified phenol resin obtained by polycondensing a petroleum-based heavy oil or pitches with a formaldehyde polymer and phenols in the presence of an acidic catalyst, (C) an inorganic filler, (D) a curing accelerator and (E) a cyclic phosphazene compound.
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