| 摘要 |
An improved integrated circuit device that includes both bond pads and trim pads is disclosed. Electrically conductive, non-wettable and non-corrosive protective caps are formed over each of the trim pads. With this arrangement, the protective caps act as barriers between the trim pads and solder used to form solder bumps when the IC package is mounted onto a substrate. In one embodiment, the protective caps are formed from a material that is easily sputtered, such as titanium. In a method aspect of the invention, the protective caps are applied during wafer level processing before either the solder bumping or trimming operations.
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