| 摘要 |
PURPOSE:To provide a method for removing a water-soluble resist excellent in inhibition of dissolution of solder and also excellent in prevention of deposition of lead. CONSTITUTION:A plating resist is formed using a water-soluble resist on a substrate with laminated copper foil, solder plating is carried out and then the water-soluble resist is removed with a removing soln. contg. 0.5-100g/l triethyl phosphate and further contg. at least one among aminoguanidine, hydrazines, sulfurous acid and dithionous acid or their salts, borohydride, carbazinic ester, thiourea dioxide, sulfinic acids, sulfoxy acids, hydrazides and semicarbazide salt. |
