| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder for electronic apparatus in which oxidation is suppressed, and strength is improved. SOLUTION: For attaining the above purpose, in this invention, solder containing, by mass, 1 to 3% Ag, 0.5 to 1.0% Cu, 0.5 to 3% Bi and 0.5 to 3% In is incorporated with 0.01 to 0.03% Ge or 0.01 to 1% Se and 0.5 to 1.5% Sb, and the balance Sn.
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