Pick and place assembly and reflow soldering for high power active devices with a flange

摘要

A heat dissipation mechanism for high power devices allows an automatic pick-and-place and solder assembly of electrical components including the high power devices onto a circuit board in a same pick-and-place and solder process. In the heat dissipation mechanism, a device portion and a flange portion of the high power devices are placed upside down such that the flange portion dissipates heat in the device to mechanics through the circuit board.