Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape

摘要

A method of fabricating devices incorporating microelectromechanical systems (MEMS) using a UV curable tape includes providing a substrate 14 with a MEMS layer 18 arranged on one side 12 of the substrate 14. A further layer 10 is applied to the side 12 of the substrate 14. At least one operation is performed on the substrate 14 from a side 22 of the substrate 14 opposed to the side 12 having the MEMS layer 18. A holding tape 38 is applied to the side 22 of the substrate. At least one operation is then performed on the further layer 10 to define individual chips 20. Each chip 20 is composed of a part of the substrate 24, at least one part of the MEMS layer 18 and a part of the further layer 10. Individual chips 20 are then able to be released from the tape 38 by exposing the tape 38 to UV light.