| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated semiconductor device for high-density mounting with no significant increase in mounting area compared to the case when a single semiconductor device is mounted. SOLUTION: A first semiconductor device 10 is mounted on one surface of a wiring board 30 comprising a film-like board while a second semiconductor device 20 is mounted on the other surface of the wiring board 30. Related to the wiring board 30, a part except for the region held between the first and second semiconductor devices 10 and 20 is bent along the second semiconductor device 20 so that a part of the wiring board 30 is arranged on the rear surface of the second semiconductor device 20, with a solder ball 40 fitted to a connection terminal provided to the wiring board 30 arranged on the rear surface of the second semiconductor device 20. The first and second semiconductor devices 10 and 20 can be electrically connected to an external terminal through the wiring board 30 and the solder ball 40. |
