发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To clamp a light emitting device body in an adequate state and install a cap. SOLUTION: When the light emitting device body 100 is picked up with a suction nozzle 130, positioning protrusions 132, 134, 136 and a plane type protrusion 138 of the nozzle 130 engage with positioning recesses 102, 104, 106 and a flat edge 108, and position and suck strictly the light emitting device body 100 to the nozzle 130. Clamping surfaces 154A, 154B do not engage with the positioning recesses 102, 104, 106 and the flat edge 108 of the device body 100 but abut against only the outward form part of the body 100 and clamp the body 100. As a result, the body 100 which is positioned and held with the nozzle 130 is clamped while the attitude is maintained, so that arrangement free from position deviation is enabled.
申请公布号 JP2001332801(A) 申请公布日期 2001.11.30
申请号 JP20000150347 申请日期 2000.05.22
申请人 SONY CORP 发明人 AIZAWA YOSHIYUKI
分类号 H01L21/50;H01S5/022;(IPC1-7):H01S5/022 主分类号 H01L21/50
代理机构 代理人
主权项
地址