| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist application treatment device and method that can collect unnecessary resist liquid such as the resist liquid that is removed from a wafer for reutilizing when a resist film is to be formed on a substrate such as a semiconductor wafer. SOLUTION: A resist application treatment device 70 is composed of a resist application unit (COT) that is an application treatment part for applying the resist liquid onto the substrate, a collection part 80 that collects the resist liquid that is discharged from the resist application unit (COT), a thickening treatment part 30 that condenses the discharged resist liquid that is stored into the collection part 80, a solvent collection part (thinner collection part) 32 that liquefies the vapor of a volatile solvent that is generated when the discharged resist liquid is subjected to thickening treatment, and a mixing treatment part 40 that mixes a thickening resist liquid that is manufactured at the thickening treatment part 30 with the volatile solvent or new volatile solvent that is manufactured at the solvent collection part 32. |
