| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a circuit board flip-chip-mounted with a semiconductor chip and method of manufacturing the same, wherein a repair work or reworking is possible for the chip and even a bare chip for area wiring of a fine pitch can be flip-chip-mounted. SOLUTION: Ni plating bumps 14 are formed on Al pad sections 12 on the surface of a bare chip 10, and an Ag- or AgPa-based conductive adhesive 20 is printed on wiring electrodes 18 on the surface of a circuit board 16. The bare chip 10 is placed facedown on the circuit board 16, with the leading edges of the Ni plating bumps 14 of the bare chip 10 inserted into an upper face of the cured conductive adhesive 20 on the wiring electrodes 18 on the circuit board 16, that is, the Al pad sections 12 on the surface of the bare chip 10 and the wiring electrodes 18 on the surface of the circuit board 16 are electrically connected through the Ni plating bumps 14 and the conductive adhesive 20. |
