| 摘要 |
PROBLEM TO BE SOLVED: To improve thermal conductivity, make manufacturing cost and characteristics compatible, and make different characteristics compatible. SOLUTION: An insulating layer 203 is included between a heat sink 107 having a recessed part 106 where the periphery is surrounded by a sidewall 101a on one surface, and a lead frame 202 that is arranged at one surface of the heat sink 107. The insulating layer 203 is made of a mixture containing an inorganic filler and a resin constituent, and filling is made also into the gap between the inside of the recessed part 106 and the frame of the lead frame 202, thus laminating and integrating the lead frame 202 and the heat sink 107.
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