| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that burrs, chippings, or the like are formed to cause shape failure when dividing a ceramic substrate into each wiring board. SOLUTION: When a large number of wiring boards 9 are formed by cutting and separating one ceramic substrate 7 along division grooves 6, metal parts 5 are formed at regions immediately below the division grooves 6 of the ceramic substrate 7. |
