| 摘要 |
PROBLEM TO BE SOLVED: To make a bonding structure strong and make a bonding of even a metal wire made of an easily oxidized material possible when bonding the metal wire to a metal plate such as a lead frame. SOLUTION: In the place of the metal plate where the metal wire is to be bonded, a hole of the size in conformity with the thickness of the metal wire is formed. Towards the hole, the metal wire is disposed nearly vertically to the surface of the metal plate. Then, the metal wire is pressed against the metal plate to be bonded, causing a leading edge of the metal wire to enter the inside of the hole or even to project on the back side. Consequently, the metal plate and the metal wire are bonded firmly into a stable bonded state. |
