| 摘要 |
PROBLEM TO BE SOLVED: To provide the resin-sealing method of an LED chip that can accurately and easily control the height of the resin-sealing part of the LED chip, can obtain desired light emission luminance without any fluctuation when a resin- sealed LED chip is subjected to light emission, and is suitable for a dot-matrix LED display, a photosensor, the light emission equipment of optical communication, or the like. SOLUTION: Metal wiring 3a and 3b with a specific pattern is provided on a substrate 1, at the same time, a part other than a sealing region with specific area including a position where an LED chip 2 is to be mounted on the substrate is covered with a resist layer 5, the metal wiring 3a, 3b, and resist layer 5 are subjected to surface treatment, the difference between the metal wiring 3 and resist layer 5 in water repellency is increased, the LED chip 2 is mounted at the position where the LED chip 2 is to be mounted, one electrode is directly connected to the metal wiring 3a by solder, the other is connected to the metal wiring 3b by a bonding wire 7, and the amount of epoxy resin 6 that is determined according to the area of the sealing region and the height of a resin-sealing part 6 is injected to a sealing region 4 where the LED chip 2 is mounted for forming the resin-sealing part 6 with specific height. |
