| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor laser device having good heatsinking property. SOLUTION: A semiconductor laser device 1 has an insulating film 3, an Au electrode 5, and a soldering material 6 formed in order on a sub mount substrate 2. The soldering material 6 fixes a semiconductor laser element 7 onto the Au electrode 5. The semiconductor laser device 1 further comprises a layer 4, which is formed between the insulating film 3 and the Au electrode 5 and contains carbon.
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