| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ceramic circuit board in which heat-resistance cycle characteristics and bending strength characteristics are improved, to obtain a ceramic circuit board which is improved in reliability in a corrosive atmosphere and prevented from short-circuiting between metal plates, and to obtain a ceramic circuit board which is improved in the soldering yield of an Si chip, etc., in postprocessing. SOLUTION: A ceramic circuit board has a metal plate 2 joined integrally with the top surface of a ceramic substrate 1 across a solder layer 3. The area of the join surface A between the metal plate 2 and solder material layer 3 is smaller than the surface area of the metal plate 2 on the side of a nonjoin surface B, and the area of the join surface C between the solder material layer 3 and ceramic substrate 1 is larger than the area of the join area A between the metal plate 2 and solder material layer 3.
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